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Thursday, July 23, 2020 | History

3 edition of Characterization and metrology for ULSI technology found in the catalog.

Characterization and metrology for ULSI technology

International Conference on Characterization and Metrology for ULSI Technology (2005 Richardson, Tex.)

Characterization and metrology for ULSI technology

by International Conference on Characterization and Metrology for ULSI Technology (2005 Richardson, Tex.)

  • 23 Want to read
  • 29 Currently reading

Published by American Institute of Physics in Melville, N.Y .
Written in English

    Subjects:
  • Integrated circuits -- Ultra large scale integration -- Congresses,
  • Integrated circuits -- Ultra large scale integration -- Congresses -- Software

  • Edition Notes

    Includes bibliographical references and index.

    Statementeditors, David G. Seiler ... [et al.]
    GenreCongresses, Software
    SeriesAIP conference proceedings -- v. 788, AIP conference proceedings -- no.788.
    ContributionsSeiler, David G., National Institute of Standards and Technology (U.S.)
    Classifications
    LC ClassificationsTK7874.76 .I56 2005
    The Physical Object
    Paginationxx, 667 p. :
    Number of Pages667
    ID Numbers
    Open LibraryOL23140235M
    ISBN 100735402779
    LC Control Number2005931820

      Song, G, Yang, X, Tao, M & Huang, J , Nondestructive thickness determination of high-k dielectric HfO 2 and interfacial oxide by spectroscopic ellipsometry. in AIP Conference Proceedings. vol. , pp. , International Conference on Characterization and Metrology for ULSI Technology, Richardson, TX, United States, 3/15/Author: Guanghua Song, Xiaolong Yang, Meng Tao, Jianyu Huang. Melville, NY, June 6, — AIP Publishing, a division of the American Institute of Physics (AIP) (), announces that through an agreement with the National Institute of Standards and Technology (NIST), proceedings papers from the entire International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (formerly Characterization and Metrology for ULSI.

    AIP Conference Proceedings: The International Conference on Characterization and Metrology for ULSI Technology, p. () G. S. Shekhawat, G. A. D. Briggs, O. V. Kolosov, and R. E. Geer Nanoscale elastic imaging and mechanical modulus measurements of aluminum/low-k . Jared, Bradley Howell, and Tran, Hy D. Metrology Artifacts for Additive Manufacturing Process States: N. p., Web.

    David G. Seiler is the author of Life on Hold ( avg rating, 2 ratings, 0 reviews, published ), Frontiers of Characterization and Metrology for Na 4/5(1). A seemingly unread FINE with previous owner's stamp on bottom of half title page and his name and date neatly written on the bottom edge of book. In an unclipped lightly rubbed FINE(-) Dj. [ WL SI 83/2. 1st.


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Challenges to Advanced Materials Characterization for ULSI Applications. Authors; Authors and affiliations Characterization and Metrology for ULSI Technologyedited by D.G.

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He has edited the Handbook of Silicon Semiconductor Metrology and prepared a web-based short course based on this book available from SEMIZONE. He has coedited five books that are conference proceedings from “Characterization and Metrology for ULSI Technology” and its predecessor conference.ABOUT THE BOOK Engineering Metrology and Measurements is a core subject for mechanical, production, and allied disciplines in all the major universities in India.

Although there are a few good books available on metrology, the coverage of topics on mechanical measurements is either scanty or.Related names.

Contributor: International Conference on Frontiers of Characterization and Metrology for Nanoelectronics Seiler, David G. National Institute of Standards and Technology (U.S.) Related titles. Characterization and metrology for ULSI technology.